Integrated heat spreader and method of fabrication
US8136244B2 · kind B2 · utility
1Cited by
1References
12Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Mar 11, 2008 |
| Grant date | Mar 20, 2012 |
| Priority date | — |
| Expiry date | Dec 11, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T83/0207
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrated heat spreader is disclosed in which grooves are formed in a recess of the heat spreader to enhance the stiffness and strength of the integrated heat spreader without increasing production costs or complexity. The integrated heat spreader may be fabricated by providing a metal strip having raised portions thereon to provide a recess therebetween, forming grooves on a bottom surface of the recess, where the grooves extend along a periphery of the bottom surface which is substantially free of the raised portions, and subsequently singulating an integrated heat spreader from the metal strip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.