Electronic sign module housing having an overmolded gasket seal
US8136279B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 29, 2008 |
| Grant date | Mar 20, 2012 |
| Priority date | — |
| Expiry date | Dec 11, 2029 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG09F2013/222
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An electronic sign module housing having an overmolded gasket seal including an elastomer overmolded gasket seal with an inner and an outer lip and a base overmolded to a rearwardly located contact surface of an electronic sign module housing. Grooves on the contact surface of the electronic sign module housing provide additional bonding surfaces with a greater surface area to enhance the chemically-bonded overmolding of the overmolded gasket seal. Truncated conical projections extending forwardly from the elastomer base extend into correspondingly shaped truncated conical cavities in the electronic sign module housing in order to provide additional chemical bonding and to provide a geometrically based frictional engagement arrangement.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.