Physical vapor deposition system
US8136480B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 14, 2005 |
| Grant date | Mar 20, 2012 |
| Priority date | — |
| Expiry date | Aug 11, 2028 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C14/22
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A physical vapor deposition system for making microparticles generated by using a non-transfer type plasma torch not generating an outgas even in an ultra-high vacuum environment accelerate by a supersonic gas flow and depositing microparticles on a substrate to form a coating film is provided. Provision is made of an evaporation chamber (10, 20) having a plasma torch (16, 26) and an evaporation source (15, 25) inside it and a film formation chamber 30 having a supersonic nozzle 35 and a substrate for film formation 33. Each plasma torch has a substantially cylindrical electrically conductive anode 40, a polymer-based or non-polymer-based insulation pipe 50 inserted to the inner side of that and generating less outgas than a phenol resin, and a rod shaped cathode 60 inserted to the inner side of an insulation pipe 50. Microparticles are generated from an evaporation source (15, 25) by a plasma obtained by applying voltages to the anode 40 and the cathode 60, ejected from a supersonic nozzle 35, made to ride on a supersonic gas flow, and deposited by physical vapor deposition onto a substrate for film formation 33.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.