ID label, ID card, and ID tag
US8136735B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 20, 2005 |
| Grant date | Mar 20, 2012 |
| Priority date | — |
| Expiry date | Oct 22, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D30/6758
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
As a non-contact ID label, ID tag and the like being widespread, it is required to manufacture a considerable quantity of ID labels at quite a low cost. An ID label attached to a product is, for example, required to be manufactured at 1 to several yens each, or preferably less than one yen. Thus, such a structure and a process are demanded that an ID label can be manufactured in a large quantity at a low cost. A thin film integrated circuit device included in the ID label, the ID card, and the ID tag of the invention each includes a thin film active element such as a thin film transistor (TFT). Therefore, by peeling a substrate on which TFTs are formed for separating elements, the ID label and the like can be manufactured in a large quantity at a low cost.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.