Patent · US Active

Lamination adhesion of foil to thermoplastic polymers

US8137776B2 · kind B2 · utility

0Cited by
13References
19Claims
0Family size

Assignee

Inventors

Key dates

Filing dateOct 18, 2004
Grant dateMar 20, 2012
Priority date
Expiry dateJun 1, 2029

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10T428/31692
  • WIPO fieldSurface technology, coating
  • WIPO sectorChemistry

Abstract

Disclosed is a multilayer structure, which comprises or is produced from a foil laminated to thermoplastic compositions using ethylene/butyl acrylate copolymer compositions as a tie layer. The multilayer structures can be useful as packaging films and industrial films. Also disclosed is a lamination process for producing the structure. Further disclosed are packages comprising the structures.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.