Solvent-free moisture activated latent curing surgical adhesive or sealant
US8138236B2 · kind B2 · utility
0Cited by
20References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 29, 2009 |
| Grant date | Mar 20, 2012 |
| Priority date | — |
| Expiry date | Jul 23, 2030 |
Classification
- Technology area (CPC A)Human Necessities
- CPC primaryA61L24/043
- WIPO fieldMedical technology
- WIPO sectorInstruments
Abstract
The invention relates to a novel moisture activated solvent-free latent curing adhesive or sealant mixture comprising (1) a selected poly(alkylene oxide)imine, and (2) a selected amine reactive moiety.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.