Patent · US Active

Polyamide molding materials with an improved flowability, the production thereof and its use

US8138259B2 · kind B2 · utility

0Cited by
15References
32Claims
0Family size

Assignee

Inventors

Key dates

Filing dateAug 28, 2009
Grant dateMar 20, 2012
Priority date
Expiry dateOct 12, 2030

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10T428/25
  • WIPO fieldMacromolecular chemistry, polymers
  • WIPO sectorChemistry

Abstract

The invention relates to a housing from a polyamide molding compound containing 70 to 99.5% by weight of at least one thermoplastic polyamide and 0.5 to 30% by weight of at least one polyamide oligomer with linear or branched chain structure with a number average molar mass of 800 to 5000 g/mol with basic end groups which are at least partially NH2 end groups, and carboxyl end groups, one of these end groups being present in excess and the concentration of the end group present in excess being at most 300 mmol/kg.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.