Semiconductor-encapsulating resin composition and semiconductor device
US8138266B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Mar 21, 2008 |
| Grant date | Mar 20, 2012 |
| Priority date | — |
| Expiry date | May 23, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A semiconductor-encapsulating resin composition includes a curing agent and a compound (A) having a plurality of glycidyl ether groups. When ion viscosity of the resin composition is measured under conditions of a measurement temperature of about 175° C. and a measurement frequency of about 100 Hz, minimum ion viscosity appears at about 5 seconds or later and within about 40 seconds from a measurement starting point. The minimum ion viscosity is at least about 4.0 and at most about 7.0. A maximum slope of the ion viscosity appears at about 10 seconds or later and within about 60 seconds from the measurement starting point. The maximum slope is at least about 2.0 and at most about 6.0.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.