Wire electric discharge machining method, semiconductor wafer manufacturing method, and solar battery cell manufacturing method
US8138442B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 16, 2005 |
| Grant date | Mar 20, 2012 |
| Priority date | — |
| Expiry date | Sep 5, 2027 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23H9/00
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Provided are a wire electric discharge machining method for poorly conductive materials, such as solar cell silicon, and a semiconductor wafer manufacturing method and a solar battery cell manufacturing method based on the wire electric discharge machining method. Electrical discharge machining of a high volume resistivity, hard and brittle materials, having a volume resistivity that is equal to or higher than 0.5 Ω·cm and equal to or lower than 5 Ω·cm is performed by applying a pulse voltage having a pulse width that is equal to or higher than 1 μsec and equal to or lower than 4 μsec and having a peak current at the time of machining a wire electrode that is equal to or higher than 10A and equal to or lower than 50A to a wire electrode and generating a discharge pulse between the wire electrode and a subject to be machined.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.