Integrated circuit chip made secure against the action of electromagnetic radiation
US8138566B1 · kind B1 · utility
2Cited by
14References
29Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 8, 1999 |
| Grant date | Mar 20, 2012 |
| Priority date | — |
| Expiry date | Oct 8, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A chip for a chip-incorporating portable article having a card format, such as for smartcards. The chip includes a silicon substrate layer having integrated circuits in its active face defining a central processor unit and memories. The chip also includes physical means for providing physical protection against the action of electromagnetic radiation in the infrared range of wavelength longer than 1 μm.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.