Adhesive composition for electronic components, and adhesive sheet for electronic components using the same
US8138580B2 · kind B2 · utility
4Cited by
7References
15Claims
0Family size
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Key dates
| Filing date | Sep 12, 2008 |
| Grant date | Mar 20, 2012 |
| Priority date | — |
| Expiry date | Apr 16, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/1471
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
In order to provide an adhesive composition for electronic components that is excellent in adhesion durability under long-term high temperature conditions, thermal cyclability, and insulation reliability, designed is an adhesive composition for electronic components containing a thermoplastic resin (a), an epoxy resin (b), a hardener (c), and an organopolysiloxane (d), wherein the glass transition temperature (Tg) after curing is −10° C. to 50° C. and the rate of change of Tg after heat-treating the composition at 175° C. for 1000 hours is 15% or less.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.