Wiring conductor, method for fabricating same, terminal connecting assembly, and Pb-free solder alloy
US8138606B2 · kind B2 · utility
0Cited by
3References
23Claims
0Family size
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Key dates
| Filing date | Apr 6, 2007 |
| Grant date | Mar 20, 2012 |
| Priority date | — |
| Expiry date | Mar 11, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A Pb-free Sn-based material part of a wiring conductor is provided at least at a part of its surface, and the Sn-based material part includes a base metal doped with an oxidation control element. The oxidation control element is at least one element selected from a group consisted of P, Ge, K, Zn, Cr, Mn, Na, V, Si, Ti, Al, Li, Mg and Ca. The wiring conductor is reflow processed, such that at least one of the Sn and the oxidation control element is diffused to form an alloy.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.