TCP-type semiconductor device and method of testing thereof
US8138777B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Oct 15, 2009 |
| Grant date | Mar 20, 2012 |
| Priority date | — |
| Expiry date | Jan 19, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/014
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A TCP-type semiconductor device has: a base film; a semiconductor chip mounted on the base film; and a plurality of leads formed on the base film. Each lead has: a first terminal portion including a first end that is one end of the each lead and connected to the semiconductor chip; and a second terminal portion including a second end that is the other end of the each lead and located on the opposite side of the first terminal portion. I a terminal region including the second terminal portion of the each lead, the plurality of leads are parallel to each other along a first direction, the plurality of leads include a first lead and a second lead that are adjacent to each other, and the first lead and the second lead are different in a position of the second end in the first direction.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.