Apparatus for high density low cost automatic test applications
US8138778B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Mar 30, 2006 |
| Grant date | Mar 20, 2012 |
| Priority date | — |
| Expiry date | Jun 4, 2026 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/2808
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
An apparatus for testing radio frequency (RF) and/or mixed signal semiconductor devices and or modules is described. specifically described is how the distributed stimulus for RF automatic test applications, unified testhead for automatic test applications, reverse card backplane for automatic test applications, direct coaxial interface for automatic test applications, cable-free interface for automatic test applications, micromachine switch matrix for automatic test applications, device specific module high speed date for RF automatic test applications may be used within tester apparatus described herein or in other test applications. Additionally a high speed date communications test apparatus which may be used in a variety of device testers is described herein.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.