Apparatus and method for input/output module that optimizes frequency performance in a circuit
US8138787B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 13, 2008 |
| Grant date | Mar 20, 2012 |
| Priority date | — |
| Expiry date | Mar 11, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A circuit can include a module having signal pads that are configurable to route signals between the circuit and at least one external device. The module can also have unused pads that are interleaved between the signal pads. A circuit can include a module having signal pads that are configurable to route varying signals between the circuit and at least one external device. The module can also have voltage pads that are configurable to route substantially constant voltages between at least one external device and the circuit. The signal pads can be interleaved between the voltage pads. A module with one or more of these features can achieve ideal performance in both wire bond and flip chip packages with the flexibility of setting a different input/output utilization percentage within the module.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.