Multi-chip stack structure and signal transmission method thereof
US8138825B2 · kind B2 · utility
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2References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 21, 2010 |
| Grant date | Mar 20, 2012 |
| Priority date | — |
| Expiry date | Aug 5, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH03H2001/0085
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
A multi-chip stack structure and a signal transmission method are disclosed in specification and drawing, where the multi-chip stack structure includes first and second chips. The first chip includes a first inductance coil with a first series capacitor, and the second chip includes a second inductance coil with a second series capacitor. The first and second inductance coils are magnetically coupled to each other. The magnetically coupled inductance coils and the capacitors constitute a coupling filter.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.