System and method for via structure measurement
US8139233B2 · kind B2 · utility
1Cited by
2References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 17, 2010 |
| Grant date | Mar 20, 2012 |
| Priority date | — |
| Expiry date | Nov 17, 2030 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N2021/95653
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A system for via structure measurement is disclosed. The system comprises a reflectometer, a simulation unit and a comparing unit. The reflectometer is configured to collect a measured diffraction spectrum of at least a via. The simulation unit is configured to provide simulated diffraction spectrums of the at least a via. The comparing unit is configured to determine at least a depth and at least a bottom profile of the at least a via by comparing the collected diffraction spectrum and the simulated diffraction spectrums.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.