Component-containing module
US8139368B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | May 18, 2010 |
| Grant date | Mar 20, 2012 |
| Priority date | — |
| Expiry date | Oct 5, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49206
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A component-containing module includes a core substrate which includes a lower surface including recessed portions and a raised portion, and an upper surface facing the lower surface and which includes a plurality of in-plane conductors, an integrated circuit element arranged at a location which is above the upper surface and which corresponds to the raised portion, a first passive element and a second passive element disposed in the recessed portions of the lower surface, a composite resin layer which underlies the lower surface and which has a flat or substantially flat surface, and an external terminal electrode which is disposed on the flat or substantially flat surface of the composite resin layer and which is electrically connected to the in-plane conductors of the core substrate. The component-containing module enables electronic components, such as integrated circuit elements and passive elements, to be densely arranged and to be reduced in profile and size.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.