Printed wiring board solder pad arrangement
US8139369B2 · kind B2 · utility
0Cited by
20References
24Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 14, 2008 |
| Grant date | Mar 20, 2012 |
| Priority date | — |
| Expiry date | May 11, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A printed wiring board includes solder pads to which component leads may be soldered. L-shaped solder pads of the printed wiring board allow component leads to approach the board from any of the four major sides of the printed wiring board. Each solder pad includes two legs and two respective axes. A component lead may be selectively soldered to one of the two legs of the solder pad. Thus, a component lead may approach a solder pad from one of four orthogonal directions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.