Housing for electronic ballast
US8139376B2 · kind B2 · utility
7Cited by
37References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 4, 2004 |
| Grant date | Mar 20, 2012 |
| Priority date | — |
| Expiry date | Jul 8, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/205
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An electronic housing assembly is formed with an environmental seal (20), EMI control (56) and a good thermal coupling (44, 46) made between enclosed hot electric components (48, 50) and an exterior heat sink (52, 54).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.