High frequency signal combining
US8140113B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jan 21, 2011 |
| Grant date | Mar 20, 2012 |
| Priority date | — |
| Expiry date | Jan 21, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01P1/20372
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
An integrated circuit transmission system includes a dielectric substrate wave guide and first and second substrate antennas. A substrate transmitter is operable to produce an radio frequency (RF) signal, the RF signal having first and second components. A micro-strip resonator filter module generates a filtered RF signal by adjusting phases of the first and second components of the RF signal via selection of one of a plurality of selectable tap points. A third substrate antenna generates a beam formed signal for transmission through the dielectric substrate wave guide, wherein the beam form signal is directed, via the filtered RF signal, to either the first substrate antenna or the second substrate antenna.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.