Plating apparatus
US8141512B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 29, 2007 |
| Grant date | Mar 27, 2012 |
| Priority date | — |
| Expiry date | Jan 25, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K1/0393
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A plating apparatus for plating a FPCB base board having a first conveyance region and a second conveyance region includes a shielding apparatus. The shielding apparatus includes a first shielding plate and a second shielding plate. The first shielding plate corresponds to the first conveyance region. A distance between the first shielding plate and the first conveyance region is from 5 millimeters to 20 millimeters. A width of the first shielding is equal to or larger than a width of the first conveyance region. The second shielding plate corresponds to the second conveyance region. A distance between the second shielding plate and the second conveyance region is from 5 millimeters to 20 millimeters. A width of the second shielding is equal to or larger than a width of the second conveyance region. The first and second shielding plates are made of an insulation material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.