Patent · US Active

Process for repairing a component comprising a directional microstructure by setting a temperature gradient during the laser heat action, and a component produced by such a process

US8141769B2 · kind B2 · utility

10Cited by

25References

20Claims

0Family size

Assignee

Siemens Aktiengesellschaft · DE

Inventors

Michael Ott · Wetter (Ruhr), DE
Uwe Paul · Ratingen, DE
Robert Singer · Erlangen, DE
Andreas Volek · Herzogenaurach, DE

Key dates

Filing date	Jul 22, 2005
Grant date	Mar 27, 2012
Priority date	—
Expiry date	Dec 27, 2026

Classification

Technology area (CPC B)Performing Operations; Transporting
CPC primaryB23K2101/001
WIPO fieldMachine tools
WIPO sectorMechanical engineering

Abstract

In one aspect, a repair method for repairing components comprising a base material with a directed microstructure is provided. The repair is performed in such a way that the repaired location correspondingly has a directed microstructure like the surrounding base material. A solder is applied in the region of a location to be repaired and is soldered to the component via heat exposure, a temperature gradient, i.e., for instance a temperature variation from a higher temperature to a lower temperature, is thereby produced in the region of the location to be repaired.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.