Aqueous surfactant compositions with a low pour point
US8142681B2 · kind B2 · utility
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5Claims
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Key dates
| Filing date | May 20, 2009 |
| Grant date | Mar 27, 2012 |
| Priority date | — |
| Expiry date | May 20, 2029 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09K23/017
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
Surfactant compositions which comprise (i) 10 to 90% by weight of one or more compounds selected from the group (a) to (e), and (ii) 10 to 90% by weight of water, based on the composition, are disclosed, where the compounds (a) to (e) are defined as follows: The surfactant compositions are liquid and pourable at 20° C., with a pour point below 0° C., and are useful as emulsifiers in emulsion polymerization.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.