Heat stable aryl polysiloxane compositions
US8142895B2 · kind B2 · utility
3Cited by
15References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 11, 2007 |
| Grant date | Mar 27, 2012 |
| Priority date | — |
| Expiry date | Jan 3, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31663
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A curable aryl siloxane composition is disclosed. A heat stable cured aryl polysiloxane composition is further disclosed, along with a method of making that heat stable cured aryl polysiloxane composition from the curable aryl siloxane composition. An encapsulated semiconductor device, and a method of making that encapsulated semiconductor device by coating a semiconductor element of a semiconductor device with the heat stable cured aryl polysiloxane are further disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.