Wafer bonding of micro-electro mechanical systems to active circuitry
US8143082B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 14, 2007 |
| Grant date | Mar 27, 2012 |
| Priority date | — |
| Expiry date | Mar 5, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH03H9/0547
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A single integrated wafer package includes a micro electromechanical system (MEMS) wafer, an active device wafer, and a seal ring. The MEMS wafer has a first surface and includes at least one MEMS component on its first surface. The active device wafer has a first surface and includes an active device circuit on its first surface. The seal ring is adjacent the first surface of the MEMS wafer such that a seal is formed about the MEMS component. An external contact is provided on the wafer package. The external contact is accessible externally to the wafer package and is electrically coupled to the active device circuit of the active device wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.