Method for polishing tape-shaped substrate for oxide superconductor, oxide superconductor, and base material for oxide superconductor
US8143194B2 · kind B2 · utility
1Cited by
5References
9Claims
0Family size
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Key dates
| Filing date | Aug 1, 2007 |
| Grant date | Mar 27, 2012 |
| Priority date | — |
| Expiry date | Feb 13, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24355
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
An oxide superconductor member is composed of a tape-shaped substrate, an intermediate layer formed on this substrate and an oxide superconductor thin film layer formed on this intermediate layer. A surface of the tape-shaped substrate is polished by continuously running the tape-shaped substrate. The polishing step includes initial polishing process and finishing process which are carried out such that the average surface roughness Ra of the substrate becomes 2 nanometers or less and the in-plane directionality of the intermediate layer becomes 5° or less after the polishing step.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.