Method for forming resist pattern, method for producing circuit board, and circuit board
US8143533B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | May 17, 2006 |
| Grant date | Mar 27, 2012 |
| Priority date | — |
| Expiry date | Mar 27, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1394
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
There are provided a method for forming a resist pattern for preparing a circuit board having a landless or small-land-width through-hole(s) to realize a high-density circuit board, a method for producing a circuit board, and a circuit board. A method for forming a resist pattern, comprising the steps of forming a resin layer and a mask layer on a first surface of a substrate having a through-hole(s), and removing the resin layer on the through-hole(s) and on a periphery of the through-hole(s) on the first surface by supplying a resin layer removing solution from a second surface opposite to the first surface of the substrate, and a method for producing a circuit board using the method for forming a resist pattern, and a circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.