Method of depositing protective structures
US8143594B2 · kind B2 · utility
3Cited by
6References
19Claims
0Family size
Inventors
Key dates
| Filing date | Feb 5, 2010 |
| Grant date | Mar 27, 2012 |
| Priority date | — |
| Expiry date | Jun 26, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J2237/31749
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A process of preparing a lamella from a substrate includes manufacturing a protection strip on an edge portion of the lamella to be prepared from the substrate, and preparing the lamella, wherein the manufacturing the protection strip includes a first phase of activating a surface area portion of the substrate, and a second phase of electron beam assisted deposition of the protective strip on the activated surface area portion from the gas phase.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.