Patent · US Active

Hierarchical bounding of displaced parametric surfaces

US8144147B2 · kind B2 · utility

9Cited by

6References

27Claims

0Family size

Assignee

Intel Corporation · US

Inventors

Jacob Munkberg · Malmö, SE
Jon N. Hasselgren · Bunkeflostrand, SE
Robert M. Toth · Lund, SE
Tomas G. Akenine-Moller · Lund, SE

Key dates

Filing date	Apr 7, 2010
Grant date	Mar 27, 2012
Priority date	—
Expiry date	Apr 29, 2030

Classification

Technology area (CPC G)Physics
CPC primaryG06T17/20
WIPO fieldComputer technology
WIPO sectorElectrical engineering

Abstract

Hierarchical bounding of displaced parametric surfaces may be a very common use case for tessellation in interactive and real-time rendering. An efficient normal bounding technique may be used, together with min-max mipmap hierarchies and oriented bounding boxes. This provides substantially faster convergence for the bounding volumes of the displaced surface, without tessellating and displacing the surface in some embodiments. This bounding technique can be used for different types of culling, ray tracing, and to sort higher order primitives in tiling architectures.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.