Heating resistor element, manufacturing method for the same, thermal head, and printer
US8144175B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 20, 2008 |
| Grant date | Mar 27, 2012 |
| Priority date | — |
| Expiry date | Oct 26, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49826
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
Provided is a heating resistor element (1), including: an insulating substrate (9); a heat accumulating layer (10) bonded to a surface of the insulating substrate (9); and a heating resistor (11) provided on the heat accumulating layer (10), in which: on at least one of bonded surfaces (9a) between the insulating substrate (9) and the heat accumulating layer (10), at least one of the insulating substrate (9) and the heat accumulating layer (10) is provided with a concave portion (16) in a region opposed to the heating resistor (11) to form a hollow portion (17); and the hollow portion (17) includes an inner surface on a side of the insulating substrate (9), the inner surface being processed to have surface roughness (Ra) of 0.2 μm or more. Accordingly, heat accumulation in a gas of the hollow portion (17) can be suppressed to improve printing quality.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.