Method to locate and eliminate manufacturing defects in a quartz resonator gyro
US8144317B1 · kind B1 · utility
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2References
9Claims
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Assignee
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Key dates
| Filing date | Mar 30, 2011 |
| Grant date | Mar 27, 2012 |
| Priority date | — |
| Expiry date | Mar 30, 2031 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N2021/8845
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method for locating and eliminating defects on a substrate wafer includes illuminating a top surface of the substrate wafer with a first illumination source, illuminating a bottom surface of the substrate wafer with a second illumination source, forming an image of a portion of the top surface of the substrate wafer while the substrate wafer is illuminated by the first and second illumination sources, adjusting a contrast of the image to accentuate defects on the top surface of the substrate wafer, locating defects in the image, and ablating the defects on the top surface with a laser.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.