Methodology to enable wafer result prediction of semiconductor wafer batch processing equipment
US8145337B2 · kind B2 · utility
7Cited by
30References
20Claims
0Family size
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Key dates
| Filing date | Nov 16, 2007 |
| Grant date | Mar 27, 2012 |
| Priority date | — |
| Expiry date | Dec 23, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S430/146
- WIPO fieldControl
- WIPO sectorInstruments
Abstract
A method to enable wafer result prediction from a batch processing tool, includes collecting manufacturing data from a batch of wafers processed in batch in the batch processing tool, to form a batch processing result; defining a degree of freedom of the batch processing result based on the manufacturing data; and performing an optimal curve fitting by trial and error for an optimal function model of the batch processing result based on the batch processing result.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.