Method for packaging a sensor unit
US8146247B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 16, 2009 |
| Grant date | Apr 3, 2012 |
| Priority date | — |
| Expiry date | Dec 2, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49176
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method for packaging the sensor units is shown below. First step is providing a substrate, and each sensor area on the substrate is partitioned into two individual circuit areas. An emitter and a detector are installed on the two circuit areas respectively. Step two is forming a first packaging structure to cover the two circuit areas, the emitter and the detector by a mold. Next step is cutting the first packaging structure to form cut groove between and around the emitter and the detector. Next step is forming a second packaging structure in the cut grooves by the same mold. At last, the panel of sensor units is diced and separated as individual sensor units. As above-mentioned, the second packaging structure is used for isolating the signals of the emitter and the detector.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.