Modular flooring assemblies
US8146319B2 · kind B2 · utility
15Cited by
56References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 30, 2009 |
| Grant date | Apr 3, 2012 |
| Priority date | — |
| Expiry date | Apr 30, 2029 |
Classification
- Technology area (CPC E)Fixed Constructions
- CPC primaryE04F2201/026
- WIPO fieldCivil engineering
- WIPO sectorOther fields
Abstract
A modular flooring assembly including a flooring component adhered to a tray substrate is described. The modular flooring assembly may be interconnected with additional modular flooring assemblies to form a modular floor suitable for most flooring applications. The flooring component may be tile or wood or other materials commonly used in flooring applications. Convention fill-in grout or a snap-in grout may be used with the modular flooring assemblies. One suitable snap-in grout is a right angle grout member.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.