Electroplating method and electroplated product
US8147671B2 · kind B2 · utility
0Cited by
8References
19Claims
0Family size
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Key dates
| Filing date | Nov 23, 2009 |
| Grant date | Apr 3, 2012 |
| Priority date | — |
| Expiry date | Jun 8, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/12736
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method for electroplating a substrate having an aluminum alloy surface comprises: applying a zinc layer onto the aluminum alloy surface; electroplating a first copper layer onto the zinc layer from an alkaline copper electroplating solution; electroplating a second copper layer onto the first copper layer from an acid copper electroplating solution; electroplating a Cu—Sn alloy layer onto the second copper layer from a Cu—Sn electroplating solution; and electroplating a chromium layer onto the Cu—Sn alloy layer from a trivalent chromium solution. The alkaline copper electroplating solution is substantially free of cyanide ion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.