Lithography processes using phase change compositions
US8147742B2 · kind B2 · utility
8Cited by
23References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 23, 2005 |
| Grant date | Apr 3, 2012 |
| Priority date | — |
| Expiry date | Jun 26, 2026 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB82Y40/00
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A lithography method includes the steps of: A) filling a mold having a patterned surface with a phase change composition at a temperature above the phase change temperature of the phase change composition; B) hardening the phase change composition to form a patterned feature; C) separating the mold and the patterned feature; optionally D) etching the patterned feature; optionally E) cleaning the mold; and optionally F) repeating steps A) to D) reusing the mold. The PCC may include an organofunctional silicone wax.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.