Method of making and using alloy susceptor with improved properties for film deposition
US8147909B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 26, 2009 |
| Grant date | Apr 3, 2012 |
| Priority date | — |
| Expiry date | Apr 22, 2030 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C16/4581
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Provided is a method for processing a wafer that includes providing an alloy susceptor including an exterior surface and a wafer contact surface. The exterior surface of the alloy susceptor is treated to produce a roughness of the exterior surface. The roughened exterior surface of is coated with a ceramic material. The alloy susceptor including the ceramic-coated roughened exterior surface is positioned in a wafer process chamber. A plurality of layers of a film are deposited on the ceramic-coated roughened exterior surface of the alloy susceptor, wherein a first adhesion exists between the plurality of layers of the film and the ceramic material coated on the roughened exterior surface of the alloy susceptor that is greater than a second adhesion that would exist between the plurality of layers of the film and a non-roughened exterior surface of the alloy susceptor without the ceramic material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.