Patent · US Active

Process for producing a contact area of an electronic component

US8148195B2 · kind B2 · utility

1Cited by
2References
15Claims
0Family size

Assignee

Inventors

Key dates

Filing dateSep 13, 2010
Grant dateApr 3, 2012
Priority date
Expiry dateOct 19, 2030

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY02P70/50
  • WIPO fieldSemiconductors
  • WIPO sectorElectrical engineering

Abstract

A process for forming at least one local contact area of a substrate of an electrical component for contacting the contact area with a connector, in which the substrate, on the contact side, is provided with a sintered porous metal layer. To make available a mechanically durable, electrically faultless solderable contact area, it is proposed that the porous layer be compacted and/or removed in the contact area to be formed.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.