Integrated circuit chip with smart pixels that supports through-chip electromagnetic communication
US8148202B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 14, 2011 |
| Grant date | Apr 3, 2012 |
| Priority date | — |
| Expiry date | Feb 14, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3011
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
One embodiment of the present invention provides an integrated circuit chip, including an active face upon which active circuitry and signal pads reside, and a back face opposite the active face. The integrated circuit chip additionally comprises an electromagnetic via that facilitates communication between signal pads on the integrated circuit chip and signal pads on a second integrated circuit chip. The electromagnetic via couples a signal pad on the active face of the integrated circuit chip to the back face of the integrated circuit chip so that the integrated circuit chip can communicate with the second integrated circuit chip while the back face of the integrated circuit chip is adjacent to the active face of the second integrated circuit chip. Moreover, the electromagnetic via operates by facilitating non-conductive signaling through the integrated circuit chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.