Resin composition and molded product
US8148453B2 · kind B2 · utility
1Cited by
0References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 26, 2010 |
| Grant date | Apr 3, 2012 |
| Priority date | — |
| Expiry date | Aug 26, 2030 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L51/04
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A resin composition containing at least (A) a polylactic acid, (B) a phosphazene compound, and (C) a rubber and/or thermoplastic elastomer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.