Optical communication module
US8148735B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 6, 2006 |
| Grant date | Apr 3, 2012 |
| Priority date | — |
| Expiry date | Aug 1, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10106
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An infrared data communication module (A1) includes a substrate (1) consisting of a first layer (1A) and a second layer (1B), where the first layer is formed with a recess (11) open at its obverse surface, and includes the opening of the recess (11) and the second layer is fixed to the first layer (1A) on the side opposite from the opening. The module also includes a bonding conductor layer (6A) covering at least the bottom surface of the recess (11), a light emitting element (2) mounted on the bonding conductor layer (6A), and a heat dissipating conductor layer (6C) sandwiched between the first layer (1A) and the second layer (1B) and connected to the bonding conductor layer (6A).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.