Partitioning of electronic packages
US8148808B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 2, 2008 |
| Grant date | Apr 3, 2012 |
| Priority date | — |
| Expiry date | Sep 25, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/1433
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Partitioning electronic sensor packages is provided. The electronic sensor package includes an electronic component, a sensor device, and electrical connections between the electronic component and the sensor device. A dam is written in the electronic sensor package to partition the package into two or more sections, where the sensor device is situated at least partially in one section and the electronic component is situated at least partially in another section. The partitioning of the dam allows the two sections to be filled with different fill materials. For example, the section with the sensor device can be filled with a soft gel-like material to provide some moisture protection to the sensor device without causing detrimental stresses to the sensor device, while the section with the electronic component can be filled with a highly moisture protective epoxy.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.