Micromachined piezoelectric ultrasound transducer arrays
US8148877B2 · kind B2 · utility
64Cited by
31References
24Claims
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Key dates
| Filing date | Apr 8, 2011 |
| Grant date | Apr 3, 2012 |
| Priority date | — |
| Expiry date | Apr 8, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/42
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
A piezoelectric composite micromachined ultrasound transducer including single and multilayer 1-D and 2-D arrays having through-wafer-vias (TWVs) that significantly decreased electrical impedance per element, and hence the improved electrical impedance matching to T/R electronics and improved signal to noise ratio is disclosed. The TWVs facilitate integrated interconnection in single element transducers (positive and negative contact on the same side) and array transducers (contact pads array for integration with T/R switches and/or pre-amplifier circuits).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.