Pressure-bonded ball diameter detecting apparatus and pressure-bonded ball diameter detecting method
US8149276B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 9, 2010 |
| Grant date | Apr 3, 2012 |
| Priority date | — |
| Expiry date | Dec 9, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/014
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Improving detectability of a diameter of a pressure-bonded ball bonded by a bonding apparatus by calculating the diameter of the pressure-bonded ball by obtaining a first tentative radius by subtracting a distance between a line representing an outline of a pad short side and a curving line representing an outline of a pressure-bonded ball from a distance between the line representing the outline of the pad short side and a bonding-control-center position of the pressure-bonded ball; obtaining a second tentative radius by subtracting a distance between a line representing an outline of a pad short side that faces toward the pad with which the first tentative radius is calculated and an outline of a pressure-bonded ball from a distance between the line representing the outline of the pad short side and a bonding-control-center position of the pressure-bonded ball; and averaging the same number of the first and the second tentative radii.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.