Thin film structure with controlled lateral thermal spreading in the thin film
US8149539B2 · kind B2 · utility
5Cited by
8References
19Claims
0Family size
Assignee
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Key dates
| Filing date | Dec 8, 2010 |
| Grant date | Apr 3, 2012 |
| Priority date | — |
| Expiry date | Dec 8, 2030 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG11B2005/0021
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An apparatus includes a magnetic layer, a heat sink layer, and a thermal resistor layer between the magnetic layer and the heat sink layer. The apparatus may be configured as a thin film structure arranged for data storage. The apparatus may also include an interlayer positioned between the magnetic layer and the thermal resistor layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.