Patent · US Active

Thermal fluid-structure interaction simulation in finite element analysis

US8150668B2 · kind B2 · utility

1Cited by
0References
20Claims
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Key dates

Filing dateFeb 11, 2009
Grant dateApr 3, 2012
Priority date
Expiry dateSep 30, 2030

Classification

  • Technology area (CPC G)Physics
  • CPC primaryG06F2119/08
  • WIPO fieldComputer technology
  • WIPO sectorElectrical engineering

Abstract

Simulation of thermal fluid-structure interaction using bulk flow fluid elements (BFFEs) is described. Each BFFE is configured to include the following characteristics: 1) at least one surrounding layer of solid elements representing either the surrounding structure or the pipe wall; 2) a layer of shell elements or Bulk Node Segments representing the outer boundary of the fluid; 3) a Bulk Node at the center of the BFFE for defining fluid properties (e.g., density, specific heat) and volume (i.e., fluid volume is calculated as the enclosed volume between the Bulk Node and all of the Bulk Node Segments that surround it); 4) a fluid flow beam element or Bulk Node Element for defining fluid flow path to another BFFE; and 5) a contact interface between the solid elements and the shell elements for conducting fluid-structure thermal interaction.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.