Patent · US Active

Layer cutting apparatus

US8151674B2 · kind B2 · utility

2Cited by
15References
6Claims
0Family size

Assignee

Inventors

Key dates

Filing dateAug 30, 2010
Grant dateApr 10, 2012
Priority date
Expiry dateAug 30, 2030

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10T83/9292
  • WIPO fieldMachine tools
  • WIPO sectorMechanical engineering

Abstract

A layer cutting apparatus includes a tray having an interior defined by a bottom and sidewall. A sleeve is at least partially disposed in the interior of the tray, and a cutting line is attached to the sleeve. The cutting line is configured to be removed from the sleeve by pulling the line away from the tray at one point of the sidewall.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.