Layer cutting apparatus
US8151674B2 · kind B2 · utility
2Cited by
15References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 30, 2010 |
| Grant date | Apr 10, 2012 |
| Priority date | — |
| Expiry date | Aug 30, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T83/9292
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A layer cutting apparatus includes a tray having an interior defined by a bottom and sidewall. A sleeve is at least partially disposed in the interior of the tray, and a cutting line is attached to the sleeve. The cutting line is configured to be removed from the sleeve by pulling the line away from the tray at one point of the sidewall.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.