Laminate structure with electronic devices and method
US8152093B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 18, 2008 |
| Grant date | Apr 10, 2012 |
| Priority date | — |
| Expiry date | Jan 1, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24802
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Various laminate structures and methods of making laminate structures are provided. In one embodiment, a laminate structure includes a base layer, a metallized layer comprising an electronic/embedded device which is adhered to the base layer. A coating layer which is adhered to the conductive layer, and a non-metallic dichroic layer adhered to the coating layer. In another embodiment, the non-metallic dichroic layer directly contacts the electronic/embedded devices of the conductive layer. The laminate structures herein can be used in the hull of the air vehicles to communicate with satellites and ground based receiving stations, for example. The electronic/embedded devices of the laminate structures provide a low weight solution to transmitting and receiving data within an air vehicle.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.