Patent · US Active

Pressure-sensitive adhesive tapes for bonding printing plates

US8152944B2 · kind B2 · utility

6Cited by

8References

19Claims

0Family size

Assignee

tesa SE · DE

Inventors

Kai Ellringmann · Hamburg, DE
Kristin Kerber · Hamburg, DE
Thorsten Krawinkel · Hamburg, DE
Jochen Fiencke · Hamburg, DE

Key dates

Filing date	May 8, 2009
Grant date	Apr 10, 2012
Priority date	—
Expiry date	May 11, 2029

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T428/2848
WIPO fieldBasic materials chemistry
WIPO sectorChemistry

Abstract

Composition for preparing a crosslinked pressure-sensitive adhesive, comprising a pressure-sensitive adhesive comprising a polymer component based on one or more monomers having at least one ethylenically unsaturated bond and for which the glass transition temperatures Tg of the corresponding homopolymers are at least 0° C., some of the monomers having at least one ethylenically unsaturated bond also having at least one carboxyl group, acrylic esters and/or methacrylic esters which are each selected such that the glass transition temperatures Tg of the corresponding homopolymers are not more than −20° C., at least one resin component having a softening point of at least 100° C., and at least one difunctional or polyfunctional crosslinker.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.